arXiv preprint ·

EGGPlacer: Energy-Guided Generative Chip Placement with Diffusion Models

Qi Zhou, Guojun Liu, Juanhong Zhao, Guangzhi Qi, Zehao Chen and Ming Lu

Published
Source
arXiv preprint, posted before peer review
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Read it at arXiv
Topics
Hardware ArchitectureArtificial Intelligence

Abstract

Chip placement strongly affects routed wirelength and thermal behavior, yet these downstream metrics are difficult to evaluate during macro placement. Learning-based macro placers commonly optimize the macro-only half-perimeter wirelength (HPWL), denoted mHPWL, which ignores standard cell connectivity and spatial demand. In contrast, analytical mixed-size placers optimize differentiable full netlist wirelength and density objectives but are typically unaware of thermal effects. We propose EGGPlacer, an energy-guided diffusion framework that incorporates analytical placement feedback and thermal feedback into macro placement generation. An analytical placer acts as an online physical response model, exposing the standard cell distribution and a full netlist wirelength proxy induced by each intermediate macro placement, while a differentiable thermal model provides temperature feedback. These signals are formulated as composable energies and injected throughout reverse diffusion without retraining the underlying generative model. Experiments on public placement benchmarks show that EGGPlacer achieves competitive mixed-size HPWL relative to strong analytical and learning-based macro placers. In the end-to-end evaluation, EGGPlacer also obtains the lowest average routed wirelength and peak temperature among the evaluated methods. Ablation studies further demonstrate that analytical and thermal guidance provide distinct and complementary benefits across wirelength proxies, routed wirelength, and thermal objectives.

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