arXiv preprint ·

Feature identification for parameter extraction and defect detection using machine learning

Yan Guo, Helda Pahlavani, Artem Khachaturiants, Khalid Elsayed, Jakob van de Laar, Erik Simons, Niranjan Saikumar and Hamed Sadeghian

Published
Source
arXiv preprint, posted before peer review
Published in
Metrology, Inspection, and Process Control XXXVI
DOI
10.1117/12.3011237
Original
Read it at arXiv
Cited by
1 work, as OpenAlex counts them
Topics
Machine Learning

In brief

Teaching Microscopes to Find the Right Details

The paper presents a general framework for using images from high-speed scanning probe microscopy systems to train machine-learning networks. The framework is aimed at two tasks: identifying structural features for parameter extraction and identifying defects.

What they found: The paper presents a framework for training networks on high-speed scanning probe microscopy images for two applications: feature detection to extract parameters and defect identification. The motivation is the need to inspect increasingly complex 3D structures and nanoscale defects while maintaining the throughput required in high-volume manufacturing.

AI-written summary. Check anything you rely on against the original paper.

Abstract

Process control of advanced semiconductor nodes is not only pushing the limits of metrology equipment requirements in terms of resolution and throughput but also in terms of the richness of data to be extracted to enable engineers to finetune the process steps for increased yield. The move towards 3D structures requires extraction of critical dimension parameters from structures which can vary largely from layer to layer. For in-line process control, the necessary automation forces the development of layer and equipment-specific dedicated image processing algorithms. Similarly, with the increase in stochastic defects in the EUV era, detection of defects at the nm scale requires the identification of features captured in low resolution to meet the throughput requirements of HVM fabs, which can again lead to custom algorithm development. With the emergence of ML-based image processing methods, this process of algorithm development for both cases can be accelerated. In this work, we provide the general framework under which the images obtained from high-speed scanning probe microscopy-based systems can be used to train a network for either feature detection for parameter extraction or defect identification.

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